Ball Grid Array

Stands for BGA Ball Grid Array (ball grid array structure PCB), which is an integrated circuit using an organic carrier board an encapsulation method. It has: ① Reduce encapsulation size ② Approve the function, pin count increased ③ PCB board dissolved welding self-centered. ④ high reliability and easy on the tin good electrical properties. ⑤ Low overall cost. BGA PCB board with small holes are more general, most customers BGA vias under design for the finished hole diameter 8 ~ 12mil, BGA paste it into the hole at the surface of the distance to specifications for 31.5mil for example, generally not less than 10.5mil. BGA vias required under the plug hole, BGA pads allow the ink, BGA pads are not bored.

BGA package I / O terminal or columnar joints in a circular distributed in a matrix form underneath the package, BGA technology has the advantage of I / O pin count despite an increase, but the pitch is not reduced but increased to improve assembly yield; although its power increased, but can controlled collapse chip BGA welding method, which can improve its electric performance; thickness and weight compared with the previous packaging technology has decreased; parasitic reduced, signal transmission delay is small, the frequency is greatly improved; assembly can be welded of high reliability. Speaking BGA package without mentioning Kingmax's patented Tiny BGA technology, Tiny BGA

  With the continuous development of science and technology, modern society is closely related with electronic technology, ultra-small mobile phones, ultra-small walkie-talkies, portable computers, memory, hard drives, optical drives, high-definition TV and so on miniaturization, light of the proposed stringent requirements. To achieve reach a goal, we must in the production process, component aspects depth study. SMT (Surface Mount Technology SMT) technology in tune with this trend, for the realization of electronic products, light, thin, short, small foundation.

SMT technology since the 1990s, to a mature stage, but with electronic products, according to the then type / miniaturization, networking and multimedia in the direction of the rapid development of electronic assembly technology put forward higher requirements, the new high-density assembly technologies are emerging, including BGA (Ball Grid Array BGA) is a has entered the practical stage of the high-density assembly technology. This paper attempts to assemble BGA device characteristics and quality control of solder joints to make a presentation.